July 24 -- The National Institute of Standards and Technology (NIST), Commerce, invites public input by September 22, 2023 regarding CHIPS Streamlined Supply Chain and R&D funding applications.
The CHIPS Incentives Program is authorized by Title XCIX—Creating Helpful Incentives to Produce Semiconductors for America of the William M. (Mac) Thornberry National Defense Authorization Act for Fiscal Year 2021 (Pub. L. 116–283, referred to as the CHIPS Act or Act), as amended by the CHIPS Act of 2022 (Division A of Pub. L. 117–167). The CHIPS Incentives Program is administered by the CHIPS Program Office (CPO) within the National Institute of Standards and Technology (NIST) of the United States Department of Commerce (Department).
Streamlined Supply Chain Funding Application -- The CHIPS Program Office (CPO) intends to release a notice of funding opportunity (NOFO) to solicit applications for CHIPS Incentives that will support investments in the construction, expansion, and modernization of commercial facilities in the United States for semiconductor materials and semiconductor manufacturing equipment for which the capital investment falls below $300 million.
R&D Funding Application -- The CPO will collect data and information in support of the research and development (R&D) notice of funding opportunity (NOFO) application process. The R&D NOFO will be designed to fund projects that strengthen U.S. semiconductor R&D leadership to catalyze and capture the next set of critical technologies, applications, and industries. CPO funds will be awarded to projects and programs with intended outcomes of creating a dynamic, new network of innovation for the semiconductor ecosystem in the United States. The long-term payoff will be reestablishing this sector as the engine of innovation for the U.S. domestic economy.
For both programs, information collected as part of the application process may include but is not limited to project descriptions, project timelines, narrative justifications for incentives, applicant financial information, and relevant project environmental and workforce information. CPO intends to collect information from applicants electronically, although other methods, e.g., interviews, email, etc., may also be leveraged. The primary tool will be Salesforce, which CPO leverages for NOFO applications.
CHIPS Program Office:
https://www.nist.gov/chips
Draft information collection instruments and technical documentation requested from the CPO by AEAStat.
FR notices inviting public comment:
CHIPS Streamlined Supply Chain
https://www.federalregister.gov/d/2023-15538
CHIPS R&D
https://www.federalregister.gov/d/2023-15560